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1. Alumina (Al₂O₃)

Applications:

Electrical insulators in electronic devices.

Wear-resistant components such as seals and valves.

Cutting tools for machining metals.

Biomedical implants like hip prostheses.

Fabrication Methods:

Powder pressing (uniaxial or isostatic pressing) and sintering.

Injection molding for complex shapes.

Hot pressing for improved density and strength.

Slip casting for hollow or intricate geometries.

2. Aluminum Nitride (AlN)

Applications:

Heat sinks and substrates in electronic devices due to high thermal conductivity.

Packaging materials for microelectronic components.

LED lighting systems.

Fabrication Methods:

Tape casting for thin substrates.

Hot pressing and hot isostatic pressing (HIP) for dense and high-strength parts.

Powder injection molding for intricate designs.

3. Zirconia (ZrO₂)

Applications:

Dental implants and prosthetics.

Ceramic knives and cutting tools.

Thermal barrier coatings in turbines.

Oxygen sensors and fuel cell components.

Fabrication Methods:

Powder pressing and sintering.

Gelcasting for precise shapes.

Hot isostatic pressing for enhanced mechanical properties.

Additive manufacturing for custom designs.

4. Silicon Nitride (Si₃N₄)

Applications:

Bearings and engine components in automotive and aerospace industries.

Cutting tools for high-speed machining.

Ball valves and seal rings in corrosive environments.

Medical implants such as spinal fusion devices.

Fabrication Methods:

Reaction bonding for net-shape forming.

Gas-pressure sintering for high-density parts.

Injection molding for complex geometries.

Spark plasma sintering for rapid densification.

5. Silicon Carbide (SiC)

Applications:

High-temperature heat exchangers and furnace components.

Semiconductor components like MOSFETs and diodes.

Abrasive materials for grinding and cutting.

Lightweight armor for military applications.

Fabrication Methods:

Hot pressing and sintering.

Chemical vapor deposition (CVD) for thin films.

Reaction bonding for large or complex components.

Additive manufacturing for rapid prototyping.

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Advanced ceramics like Alumina, Aluminum Nitride, Zirconia, Silicone Nitride, and Silicon Carbide have various engineering applications. For instance, Alumina is commonly used in electrical insulators and wear-resistant components. Aluminum Nitride is favored in heat dissipation applications in electronic devices. Zirconia finds use in surgical implants and high-temperature structural components. Silicone Nitride is employed in engine components due to its high strength and thermal stability. Silicon Carbide is often utilized in abrasive tools and semiconductor manufacturing.

Possible fabrication methods for these materials include sintering, hot pressing, and chemical vapor deposition.

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Advanced ceramics like Alumina, Aluminum Nitride, Zirconia, Silicone Nitride, and Silicon Carbide have various engineering applications. For instance, Alumina is commonly used in electrical insulators and wear-resistant components. Aluminum Nitride is favored in heat dissipation applications in electronic devices. Zirconia finds use in surgical implants and high-temperature structural components. Silicone Nitride is employed in engine components due to its high strength and thermal stability. Silicon Carbide is often utilized in abrasive tools and semiconductor manufacturing.

Possible fabrication methods for these materials include sintering, hot pressing, and chemical vapor deposition.

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Alumina Al2O3: Cutting tools, electrical insulators, biomedical implants. (injection molding, additive manufacturing, slip casting)

Aluminum Nitride: heat sinks, thermal management. (CVD)

Zirconia ZrO2: dental crown, fuel cell components. (injection molding, additive manufacturing, slip casting)

Silicon nitride: gas turbines, engine components, ball bearings.( hot pressing)

Silicon carbide: abrasives, semicon devices, armor plating. (hot pressing, CVD, reaction bonding)

(Powder processing and sintering for all.)

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Alumina (Al2O3)

Engineering applications: Dental implants (biomedical), insulators (electronics)

Possible fabrication methods: Sintering, Slip Casting, Injection Molding

Aluminium Nitride (AlN)

Engineering applications: Substrates for integrated circuits (electronics), piezoelectric transducers (acoustics)

Possible fabrication methods: Hot pressing, Chemical Vapor Deposition (CVD), Sintering

Zirconia(ZrO2)

Engineering applications: Structural ceramics, sensors

Possible fabrication methods: Sintering, Injection Molding, Plasma Spraying, Tape Casting

Silicon Nitride (Si3N4)

Engineering applications: Engine components, cutting tools, bearings.

Possible fabrication methods: Hot isostatic pressing, Reaction bonding, Pressureless sintering, Chemical Vapor Deposition (CVD)

Silicon Carbide (SiC)

Engineering applications: Abrasives, High-frequency electronic devices.

Possible fabrication methods: Sintering, Chemical Vapor Deposition (CVD), Reaction bonding, Hot pressing

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1.Alumina

Engineering application:

X-ray tubes, electron tubes, laser devices,aerospace devices, high vacuum applications, flow meters, pressure sensors and wear components.

Possible fabrication methods:

Alumina can be formed using several ceramic processing methods

1.Dry Pressing Method

2.Casting Molding Method

3.Extrusion Molding Method

4.Ceramic Injection Molding

5.Isostatic Pressing Method

2.Aluminum Nitride

Engineering application:

heaters, windows, IC-packages and heat sinks.

Possible fabrication methods:

1.Dry Pressing Method

2.Ceramic Injection Molding

3.Isostatic Pressing Method

3.Zirconia

Engineering application：

precision ball valve (seats and balls), valves and impellors, pump seals, oxygen sensors

Possible fabrication methods:

1.Casting Molding Method

2.Extrusion Molding Method

3.Isostatic Pressing Method

4.Silicone Nitride

Engineering application:

bearing ball and roller elements, cutting tools, valves, turbocharger rotors for engines

Possible fabrication methods:

1. Hot Pressing Method

2.Isostatic Pressing Method

5.Silicon Carbide

Engineering application:

turbine components, seals, bearings, ball valve parts and semiconductor wafer processing equipment

Possible fabrication methods:

1.Dry Pressing Method

2.Ceramic Injection Molding

3.Isostatic Pressing Method

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1. Alumina

Engineering application:

a) Substrate material for integrated circuit (ICs)

b) Medical implants

c) Spark plug insulators

Fabrication methods:

a) Powder pressing and sintering

b) Hot isostatic pressing (HIP)

c) Injection molding

2. Aluminium Nitride

Engineering application:

a) Optoelectronics

b) Silicon wafer

c) Heat sinks

Fabrication methods:

a) Hot pressing

b) Chemical vapor deposition (CVD)

C) Tape casting

3. Zirconia

Engineering application:

a) Orthopedic implants

b) Oxygen sensors

c) Cutting tools

Fabrication methods:

a) Gel casting

b) Hot pressing

c) Powder pressing and sintering

4. Silicon Nitride

Engineering application:

a) Turbochargers

b) Biomedical applications

c) Ball bearings

Fabrication methods:

a) Reaction bonding

b) Gas pressure sintering

c) Hot isostatic pressing

5. Silicon Carbide

Engineering application:

a) Semiconductor base for LEDs

b) Cutting tools

c) Wear resistant parts in pumps and rocket engines

Fabrication methods:

a) Sintering

b) Hot pressing

c) CVD or PVD

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1. Alumina (Al₂O₃)

Engineering application : Biomedical implants

Possible fabrication methods : Powder Metallurgy, Slip Casting, Injection Molding

2. Aluminium Nitride (AlN)

Engineering application : Piezoelectric transducers

Possible fabrication methods : Chemical vapor deposition (CVD), Pulsed laser deposition (PLD), Sputtering

3. Zirconia (ZrO₂)

Engineering application : Oxygen sensors

Possible fabcrication methods : Sintering, Plasma spraying, Electrochemical vapor deposition (EVD)

4. Silicon Nitride (Si₃N₄)

Engineering application : Roller bearings

Possible fabrication methods : Sintering, Grinding and Polishing, Powder Compaction

5. Silicon Carbide (SiC)

Engineering application : Electronic sensors

Possible fabrication methods : Chemical vapor deposition (CVD), Sintering, Etching, Ion implantation

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Sunil Katkar (Metrik no 23305090)

Advanced ceramics, due to their exceptional properties like high strength, hardness, thermal shock resistance, and corrosion resistance, find widespread applications in various engineering fields. Here are some examples:

1. Alumina (Al2O3)

Applications:

Engine components: Spark plug insulators, valve seats, and turbocharger components.

Cutting tools: High-speed cutting tools and grinding wheels.

Armor: Bulletproof vests and vehicle armor.

Biomedical implants: Artificial joints and dental implants.

Fabrication Methods:

Powder metallurgy: Compacting and sintering alumina powder.

Slip casting: Casting a slurry of alumina powder into molds.

Injection molding: Injecting alumina powder into molds under pressure.

2. Aluminum Nitride (AlN)

Applications:

Electronics: Heat sinks for electronic devices.

Structural ceramics: High-temperature structural components.

Acoustics: Acoustic transducers and filters.

Fabrication Methods:

Pressureless sintering: Sintering AlN powder without external pressure.

Hot pressing: Sintering AlN powder under high pressure and temperature.

Spark plasma sintering (SPS): Rapid sintering technique using pulsed electric current.

3. Zirconia (ZrO2)

Applications:

Engine components: Oxygen sensors and fuel cell components.

Dental implants: Dental crowns and bridges.

Cutting tools: Cutting tools for hard materials.

Fabrication Methods:

Powder metallurgy: Compacting and sintering zirconia powder.

Plasma spraying: Spraying molten zirconia onto a substrate.

Electrochemical deposition: Depositing zirconia onto a substrate using an electric current.

4. Silicon Nitride (Si3N4)

Applications:

Engine components: Turbocharger rotors and turbine blades.

Cutting tools: High-temperature cutting tools.

Bearings: High-temperature and high-load bearings.

Fabrication Methods:

Pressureless sintering: Sintering Si3N4 powder without external pressure.

Hot pressing: Sintering Si3N4 powder under high pressure and temperature.

Gas pressure sintering: Sintering Si3N4 powder under high pressure of nitrogen gas.

5. Silicon Carbide (SiC)

Applications:

Engine components: Ceramic brake discs and engine valves.

Cutting tools: High-temperature cutting tools.

Armor: Bulletproof vests and vehicle armor.

Fabrication Methods:

Powder metallurgy: Compacting and sintering SiC powder.

Chemical vapor deposition (CVD): Depositing SiC onto a substrate using chemical vapors.

Liquid phase sintering: Sintering SiC powder with a liquid phase.

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Alumina

Application: As electrical insulator, refractories such as furnace and crucible

Fabrication Method: Sintering it at temperature around 1400-1800 oC.

Aluminium Nitride

Application: used in electric circuits and LED packages, material packaging for high-power electronic device

Fabrication Method: Sintering it at temperature around 1600-1800 oC in a nitrogen atmosphere.

Zirconia

Application: orthopedic and dental implant, surgical tool

Fabrication Method: Sintering by hot pressing method (combined with pressure and heat)

Silicon Nitride

Application: Engine component such as valve lifers, turbocharger rotor

Fabrication Method: Sintering by hot pressing method (combined with pressure and heat)

Silicon Carbide

Application: High-power electronics such power device, solar inverter

Fabrication Method: Sintering by hot isostatic pressing (HIP) (combined with heat and gas pressure)

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1. Alumina (Al₂O₃)

Application:

Grinding wheel, Pumps, Conformance / Insulation layer for semiconductor device

Fabrication Method:

Dry pressing, Hot pressing, Sintering, Slip casting

2. Aluminum Nitride (AlN)

Application:

Semiconductor substrate / Heater layer for semiconductor device /

Fabrication Method:

Reactive sintering / Hot Isostatic Pressing (HIP) / Hot pressing

3. Zirconia (ZrO₂)

Application:

Bioceramics for joint replacement, Dental implants and prosthetics

Fabrication Method:

Injection molding / Hot Isostatic Pressing (HIP) / Sintering / Slip casting

4. Silicon Nitride (Si₃N₄)

Application:

Seal rings, Turbochargers and engine components, Waveguide material and passivation layer for semiconductor

Fabrication Method:

Hot pressing / Gas pressure sintering / Reaction bonding / Chemical Vapor Deposition (CVD)

5. Silicon Carbide (SiC)

Application:

Semiconductor substrate / Cutting tools / Ballistic armor plates

Fabrication Method:

Hot pressing / Sintering / Reaction bonding / Chemical Vapor Deposition (CVD)

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Engineering Applications of Advanced Ceramics

1. Alumina (Aluminum Oxide, (Al₂O₃)

Applications:

i. Electrical insulators in electronic circuits.

ii. Wear-resistant components like cutting tools and bearings.

iii. Biomedical implants such as hip replacements and dental crowns.

Fabrication Methods:

i. Powder pressing and sintering.

ii. Slip casting.

iii. Hot isostatic pressing (HIP).

iv. Injection molding.

2.Aluminum Nitride (AlN):

Applications:

i. Substrates for high-power electronic devices (excellent thermal conductivity and electrical insulation).

ii. Heat sinks for LED lighting.

iii. Components in aerospace and automotive thermal management.

Fabrication Methods:

i. Hot pressing.

ii.  Reactive sintering.

iii. Vapor deposition (Chemical Vapor Deposition - CVD, Physical Vapor Deposition - PVD).

3. Zirconia (Zirconium Dioxide, ZrO₂):

Applications:

i. thermal barrier coatings in jet engines.

ii. Oxygen sensors in automotive applications.

iii. High-strength dental ceramics (crowns and bridges).

Fabrication Methods:

i. Injection molding.

ii.  Tape casting.

iii. Hot isostatic pressing (HIP).

iv. Electrochemical deposition.

4. Silicon Nitride (Si₃N₄):

Applications:

i. Ball bearings and rollers in high-performance machinery.

ii. Automotive engine parts (e.g., turbochargers, valves).

iii.  Cutting tools for high-temperature machining.

Fabrication Methods:

i. Hot pressing.

ii.  Reaction bonding.

iii. Gas-pressure sintering.

iv. Additive manufacturing (Selective Laser Sintering - SLS).

5.Silicon Carbide (SiC):

Applications:

i. Abrasive materials and cutting tools.

ii. Semiconductor devices for high-power electronics.

iii. Heat exchangers and industrial furnaces (high-temperature strength).

Fabrication Methods:

i. Pressure less sintering.

ii.  Reaction bonding.

iii. Hot isostatic pressing (HIP).

iv. Additive manufacturing (Binder Jetting, Selective Laser Sintering).

These ceramics' exceptional mechanical strength, thermal stability, chemical resistance, and lightweight nature make them vital in advanced industrial and technological applications, making them important in engineering.

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Advance ceramics material , Engineering Application  23305991

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Alumina(Al₂O₃)

Application：

Insulators, cutting tools, grinding wheels, mechanical seals, substrates for integrated circuits.

Fabrication methods：

Powder Metallurgy Method, Chemical Vapor Deposition (CVD)

Aluminum Nitride(AlN）

Application：

Electronic packaging, microwave devices

Fabrication methods：

Direct Nitridation Method, Hot Pressing Sintering

Silicon Carbide(SiC）

Application：

High-temperature devices, refractory materials, power transistors

Fabrication methods：

Acheson Method, Sintering with Additives

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Material

Silicon Nitride (Si₃N₄)

Silicon nitride cannot be considered as a single material since the material properties strongly depend on the fabrication method.

Fabrication Methods

There are 3 main types of silicon nitrides that listed with their fabrication methods respectively

Reaction Bonded Silicon Nitride (RBSN) - Reaction bonding

Hot Pressed Silicon Nitride (HPSN) - Hot pressing

Sintered Silicon Nitrides (SSN) - Spark plasma sintering / Hot isostatic pressing

Engineering Application

Automotive Industry (Use as engine part or accessory unit)

Turbocharge - Lower inertia, reduced engine lag & emissions

Glow plug - Faster startup

Exhaust gas control valve - Increase acceleration

Bearing Industry

High-speed rolling bearings and seals

Aviation and Aerospace Industry

Ball bearings

Radomes

RF windows.

Electronic Industry

Use as passivation layer for integrated circuit, LED, laser diodes & solar cell

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Alumina(Al₂O₃)

Applications: X-ray tubes, electron tubes, laser devices, aerospace devices, high vacuum applications, flow meters, pressure sensors and wear components.

Fabrication methods: processed machined or net-shaped

Aluminum Nitride (AlN)

Applications: power electronics, aeronautical systems, railways, opto-electronics, semiconductor processing, microwave and military applications. heaters, windows, IC-packages and heat sinks.

Fabrication methods: Casting molding method

Zirconia

Applications: precision ball valve (seats and balls), valves and impellors, pump seals, oxygen sensors, high density grinding media, thread guides, medical prostheses, cutting blades, gears, metal forming, radio frequency heating susceptors, metrology components, bearings, bushes and drive shafts

Fabrication methods: Isostatic Pressing Method;Ceramic Injection Molding

Silicon Nitride

Applications: bearing ball and roller elements, cutting tools,

valves, turbocharger rotors for engines, glow plugs, non-ferrous molten metal handling, thermocouple sheaths, welding jigs and fixtures and welding nozzles.

Fabrication methods: Isostatic Pressing Method

Silicon Carbide

Applications: turbine components, seals, bearings, ball

valve parts and semiconductor wafer processing equipment.

Fabrication methods: Powder molding; Casting molding; Hot pressing molding

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Alumina

Applications:

1. Mechanical components such as bearings, seals and valves with wear resistant property.

2. Cutting tools, grinding wheels and abrasive materials.

3. High power applications like microwave devices, LEDs and sensors.

Fabrication methods:

1. Hot Isostatic pressing

2. Extrusion

3. Injection molding

4. Slip casting

Aluminium Nitride

Applications:

1. Electronic component such as heat sinks, power transistors, diodes and lasers.

2. Automotive engine components such as power inventers and battery systems

3. Medical applications like biomedical sensors

Fabrication methods:

1. Hot pressing

2. Hot isostatic pressing

3. Tape casting

4. Slip casting

Zirconia

Applications:

1. Acts as thermal barrier coating for turbine blades and exhaust system

2. Engine components such as valve seats and cylinder heads

3. Dental prosthetic like bridges and implants

4. Industrial cutting tools, drills and abrasive products

Fabrication methods:

1. Hot pressing

2. Hot isostatic pressing

3. Injection molding

4. Extrusion

5. Slip casting

Silicon Nitride

Applications:

1. Turbochargers and rotary engine components such as turbine blades, bearing balls, valves and seals.

2. Cutting tools

3. Welding jigs and welding nozzles

Fabrication methods:

1. Hot pressing

2. Hot isostatic pressing

3. Injection molding

4. Extrusion

5. Slip casting

6. Tape casting

Silicon Carbide

Applications:

1. Semiconductor power devices such as diodes, MOSFETs and IGBTs

2. Turbine components such as turbine blades, bearings and nozzles

3. Thermal processing applications such as beams and profiled supports, thermocouple protective sheath

4. Heating elements in furnaces

Fabrication methods:

1. Hot pressing

2. Hot isostatic pressing

3. Injection molding

4. Extrusion

5. Slip casting

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1. Aluminum Oxide (Al₂O₃)

Applications:

Bulb tubes and laser materials

Preparation method:

Sol-Gel method

Hot isostatic pressing

2. Aluminum nitride (AlN)

Applications：

Cooling system components for electric vehicles

Laser system mirror

Preparation method:

Discharge plasma Sintering

3. Zirconium oxide (ZrO₂)

Applications:

Industrial blade

Preparation method:

Powder metallurgy process

4. Silicon Carbide (SiC)

Applications:

Deep space exploration equipment

Preparation method:

Chemical Vapor impregnation

Hot wall Chemical Vapor Deposition

5. Silicon nitride (Si₃N₄):

Applications:

Spacecraft insulation

Automotive spark plug insulator

Preparation method:

Heat treatment after grouting molding

Liquid phase sintering

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Material: Alumina

Engineering applications: Insulation substrates, medical device, sensors, battery.

Fabrication methods: Extrusion, Slip casting, Injection molding

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1.) Alumina (Aluminum Oxide, Al₂O₃)

Applications:

Eletrical insulator in electronics;

Cutting tools;

Biomedical implants

Fabrication methods:

Dry pressing;

Hot pressing;

Injection molding;

Slip casting

2.) Aluminum Nitride (AlN)

Applications:

High thermal conductivity heatsink

Electrical insulator

Fabrication methods:

Hot pressing;

Sintering

Tape casting

3.) Zirconia (Zirconium Dioxide, ZrO₂)

Applications:

Dental crowns & implants

Cell membranes

Fabrication methods:

Isostatic pressing

Injection molding

Slip casting

4.) Silicon Nitride (Si₃N₄)

Applications:

Bearings and rollers for high speed & high temperature machines/tools

Semiconductor equipment

Automotive engine components

Fabrication methods:

Hot pressing

Sintering

5.) Silicon Carbide (SiC)

Applications:

Semiconductor devices for high power & frequency applications

Furnace part

Fabrication methods:

Sintering

Hot pressing

Chemical vapor deposition

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Aluminium nitride

Applications: LED substrates, Heat sinks, Plasma etching electrodes, Thermal interface materials

Fabrication: Hot pressing, Injection molding, Slip casting

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Material

Alumina (Al₂O₃)

Applications

X-ray Tubes and Electron Tubes, Aerospace Devices, Laser Devices and High-Vacuum Applications, Flow Meters and Pressure Sensors.

Fabrication Methods

Dry Pressing Method

Alumina powders is mixed with water (<4%) and binder. Then pressed into a mold under high pressure.

Ceramic Injection Molding (CIM):

Alumina powder mixed with polymer binders is injected into a mold. After solidification, the polymer is removed through thermal debinding.

Isostatic Pressing:

Alumina powder is encapsulated in a flexible mold or bag. The encapsulated powder is subjected to uniform pressure from all directions using a fluid medium, typically water or oil. The compacted part is then sintered to achieve full densification

Hot Pressing:

Alumina powder is compacted in a die and simultaneously heated to facilitate sintering during pressing.

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Name: Muhammad Ruzaini Bin Kamis Matrix No: 23201536

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Name: Muhammad Ruzaini Bin Kamis Matrix No: 23201536

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1. Alumina (Al2O3)

Application:

i) Electrical insulators in high-voltage applications

ii) Substrates for electronic circuits.

iii) Wear- resistant parts.

iv) Cutting tool and medical implants

Fabrication:

i)Powder Processing & Sintering

ii)Injection Molding

iii) Tape Casting

iv) Slip Casting

v)3D printing

2. Aluminum Nitride(AIN)

Application:

i)Led Packaging

ii)Semiconductor equipment components

iii) Electrical insulators in microelectronic applications

Fabrication:

i) Tape casting

ii) Dry press and sinter

iii) hot pressing

3. Zirconia (ZrO2)

Application:

i) Dental crown

ii) Cutting tools

iii) Thermal barrier coatings for jet engines and turbines

Fabrication

i) Hot Isostatic pressing

ii) Powder processing and Sintering

iii) Injection Molding

iv) Slip Casting

v) 3D printing

4. Silicone Carbide SiC

Application:

i) Powder electronic devices like MOSFETs and Schottky diodes due to high thermal and electrical conductivity

ii) Abrasives and cutting tools

iii) Heat exchangers

Mirror components for telescopes

Fabrication:

i) Hot pressing

ii) 3D printing

Silicon Nitride (Si3N4)

Application:

i) Ball bearings

ii) Turbine blades

iii) Wear-resistant parts

Fabrication:

i)Hot pressing

ii)Powder Processing and Sintering

iii)Hot Isostatic Pressing

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Ir. Sathu Pillay Govindasamy | S-GM0024/22

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Ir. Sathu Pillay Govindasamy | S-GM0024/22

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Material - Alumina (Al₂O₃)

Application

Cutting Tools (Inserts, Blades)

Abrasives

(Grinding Wheels, Sandpaper)

Electrical Insulators

Bioceramics

(Implants, Prosthetics)

Armor Plates

Fabrication/Processing Method

Hot pressing, sintering, CVD

Crushing and sieving of sintered alumina, fusion in arc furnaces

Slip casting, powder injection molding, tape casting, sintering

Powder metallurgy, surface polishing

Sintering, hot isostatic pressing

Material - Aluminum Nitride (AlN)

Application

Thermal Management (Heat Sinks, Substrates

Electrical Insulators in High-Voltage Devices

Microelectronics Packaging

LED Substrates

Sensors

Fabrication/Processing Method

Hot pressing, tape casting, sintering

Powder injection molding, sintering

Thin-film deposition, reactive sputtering

Tape casting, co-sintering with metallization layers

Sol-gel processing, screen printing

Material - Zirconia (ZrO₂)

Application

Dental Implants and Crowns

Thermal Barrier Coatings (Turbine Blades)

Structural Components (e.g., Bearings, Knives)

Oxygen Sensors

Fabrication/Processing Method

Isostatic pressing

Plasma spraying

Powder injection molding

Sintering

Slip casting, laser cutting for electrode integration

Material - Silicon Nitride (Si₃N₄)

Application

Engine Components (Turbochargers, Valves)

Ball Bearings (High-Speed Applications)

Thermal Shock Resistant Parts

Cutting Tools for Hard Alloys

Rocket/Spacecraft Components

Fabrication/Processing Method

Hot isostatic pressing, pressureless sintering

Isostatic pressing, sintering with post-polishing

Reaction bonding, gas pressure sintering

Hot pressing, CVD coatings

Slip casting, infiltration with silicon

Material - Silicon Carbide (SiC)

Application

Abrasives (Grinding Wheels, Sanding Media)

High-Temperature Semiconductors

Armor (Body and Vehicle Armor)

Heat Exchangers and Furnace Components

Gas Turbines (Thermal Barrier Coatings)

Fabrication/Processing Method

Crushing, sintering, fusion in electric arc furnaces

CVD or epitaxial growth for wafers

Hot pressing, reaction bonding

Sintering, slip casting of SiC slurry

Plasma spraying, vapor deposition techniques