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This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. https://www.epoxyadhesiveglue.com/product/epoxy-underfill-chip-level-adhesives/
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# data[].attributes.attachment_link.readable_text
Epoxy underfill chip level adhesives

This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.

Description
Product Specification Parameters

Product Model Product Name Color
Typical Viscosity (cps)
Curing Time Use Distinction

DM-6513

Epoxy underfill bonding adhesive

Opaque Creamy Yellow

3000~6000

@ 100℃

30min

120℃ 15min

150℃ 10min

Reusable CSP (FBGA) or BGA filler

One-component epoxy resin adhesive is a reusable filled resin CSP (FBGA) or BGA. It cures quickly as soon as it is heated. It is designed to provide good protection to prevent failure due to mechanical stress. Low viscosity allows filling gaps under CSP or BGA.

DM-6517

Epoxy bottom filler

Black

2000~4500

@ 120℃ 5min 100℃ 10min

CSP (FBGA) or BGA filled

One-part, thermosetting epoxy resin is a reusable CSP (FBGA) or BGA filler used to protect solder joints from mechanical stresses in handheld electronics.

DM-6593

Epoxy underfill bonding adhesive

Black

3500~7000

@ 150℃ 5min 165℃ 3min

Capillary Flow Filled Chip Size Packaging

Fast curing、 fast flowing liquid epoxy resin, designed for capillary flow filling chip size packaging. It is designed for process speed as a key issue in production. Its rheological design allows it to penetrate the 25μm gap, minimize induced stress, improve temperature cycling performance, and have excellent chemical resistance.

DM-6808

Epoxy underfill adhesive

Black

360

@130℃ 8min 150℃ 5min

CSP (FBGA) or BGA bottom fill

Classic underfill adhesive with ultra-low viscosity for most underfill applications.

DM-6810

Reworkable epoxy underfill adhesive

Black

394

@130℃ 8min

Reusable CSP (FBGA) or BGA bottom

filler

The reusable epoxy primer is designed for CSP and BGA applications. It cures quickly at moderate temperatures to reduce stress on other components. Once cured, the material has excellent mechanical properties to protect solder joints during thermal cycling.

DM-6820

Reworkable epoxy underfill adhesive

Black

340

@130℃ 10min 150℃ 5min 160℃ 3min

Reusable CSP (FBGA) or BGA bottom

filler

The reusable underfill is specifically designed for CSP, WLCSP and BGA applications. It is formulated to cure rapidly at moderate temperatures to reduce stress on other components. The material has a high glass transition temperature and high fracture toughness for good protection of solder joints during thermal cycling.

Product Features

Reusable Rapid curing at moderate temperatures

Higher glass transition temperature and higher fracture toughness

Ultra-low viscosity for most underfill applications

Product Advantages
It is a reusable CSP (FBGA) or BGA filler used to protect solder joints from mechanical stress in handheld electronic devices. It cures quickly as soon as it is heated. It is designed to provide good protection against failure due to mechanical stress. Low viscosity allows gaps to be filled under CSP or BGA.

# data[].attributes.attachment_link.title
Epoxy underfill chip level adhesives - Epoxy Adhesive Glue Manufacturer

# data[].attributes.attachment_link.description
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.

# data[].attributes.body
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. https://www.epoxyadhesiveglue.com/product/epoxy-underfill-chip-level-adhesives/
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# data[].attributes.attachment_link.readable_text
Epoxy underfill chip level adhesives

This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.

Description
Product Specification Parameters

Product Model Product Name Color
Typical Viscosity (cps)
Curing Time Use Distinction

DM-6513

Epoxy underfill bonding adhesive

Opaque Creamy Yellow

3000~6000

@ 100℃

30min

120℃ 15min

150℃ 10min

Reusable CSP (FBGA) or BGA filler

One-component epoxy resin adhesive is a reusable filled resin CSP (FBGA) or BGA. It cures quickly as soon as it is heated. It is designed to provide good protection to prevent failure due to mechanical stress. Low viscosity allows filling gaps under CSP or BGA.

DM-6517

Epoxy bottom filler

Black

2000~4500

@ 120℃ 5min 100℃ 10min

CSP (FBGA) or BGA filled

One-part, thermosetting epoxy resin is a reusable CSP (FBGA) or BGA filler used to protect solder joints from mechanical stresses in handheld electronics.

DM-6593

Epoxy underfill bonding adhesive

Black

3500~7000

@ 150℃ 5min 165℃ 3min

Capillary Flow Filled Chip Size Packaging

Fast curing、 fast flowing liquid epoxy resin, designed for capillary flow filling chip size packaging. It is designed for process speed as a key issue in production. Its rheological design allows it to penetrate the 25μm gap, minimize induced stress, improve temperature cycling performance, and have excellent chemical resistance.

DM-6808

Epoxy underfill adhesive

Black

360

@130℃ 8min 150℃ 5min

CSP (FBGA) or BGA bottom fill

Classic underfill adhesive with ultra-low viscosity for most underfill applications.

DM-6810

Reworkable epoxy underfill adhesive

Black

394

@130℃ 8min

Reusable CSP (FBGA) or BGA bottom

filler

The reusable epoxy primer is designed for CSP and BGA applications. It cures quickly at moderate temperatures to reduce stress on other components. Once cured, the material has excellent mechanical properties to protect solder joints during thermal cycling.

DM-6820

Reworkable epoxy underfill adhesive

Black

340

@130℃ 10min 150℃ 5min 160℃ 3min

Reusable CSP (FBGA) or BGA bottom

filler

The reusable underfill is specifically designed for CSP, WLCSP and BGA applications. It is formulated to cure rapidly at moderate temperatures to reduce stress on other components. The material has a high glass transition temperature and high fracture toughness for good protection of solder joints during thermal cycling.

Product Features

Reusable Rapid curing at moderate temperatures

Higher glass transition temperature and higher fracture toughness

Ultra-low viscosity for most underfill applications

Product Advantages
It is a reusable CSP (FBGA) or BGA filler used to protect solder joints from mechanical stress in handheld electronic devices. It cures quickly as soon as it is heated. It is designed to provide good protection against failure due to mechanical stress. Low viscosity allows gaps to be filled under CSP or BGA.

# data[].attributes.attachment_link.title
Epoxy underfill chip level adhesives - Epoxy Adhesive Glue Manufacturer

# data[].attributes.attachment_link.description
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.