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Diagrama litográfico do primeiro processador super condutor com elevada eficiência energética por com baixa eficiência térmica. Sítio: inovacaotecnologica, acessado em 08.02.2022

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Morpheus, um novo conceito de processador com implementação em hardware de geração de chaves criptográficas, tornando impossível tomar controle do software ou sistema via invasão. O processador tem um novo conceito de agitação que troca a chave de acesso via hardware muitas vezes por segundo.
sítio: www.inovacaotecnologica.com.br, acessado em 07.02.2022.

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Um dos principais componentes dos computadores, responsável por cálculos matemáticos e integração e transformação de dados. É um mecanismo complexo, construído na atualidade com transistores e semicondutores, os mais modernos tem produção sobre litografia de 4 nm.

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O inovador Elon Musk apresenta o Neuralink, processador que pretende conectar o cérebro humano a internet. Entenda como funciona.

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T Series, hardware de segurança da Apple.

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Apple silicon is a series of system on a chip (SoC) and system in a package (SiP) processors designed by Apple Inc., mainly using the ARM architecture. It is the basis of most new Mac computers as well as iPhone, iPad, Apple TV, and Apple Watch, and of products such as AirPods, HomePod, iPod Touch, and AirTag.

Apple announced its plan to switch Mac computers from Intel processors to Apple silicon at WWDC 2020 on June 22, 2020. The first Macs built around the Apple M1 processor were unveiled on November 10, 2020. By early 2022, most Mac models were built on Apple silicon; exceptions include the 27‑inch iMac and the Mac Pro.

Apple outsources the chips' manufacture but fully controls their integration with the company's hardware and software. Johny Srouji is in charge of Apple's silicon design.

Apple first used SoCs in early versions of the iPhone and iPod touch. They combine in one package a single ARM-based processing core ( CPU), a graphics processing unit ( GPU), and other electronics necessary for mobile computing.

The APL0098 (also 8900B or S5L8900) is a package on package (PoP) system on a chip (SoC) that was introduced on June 29, 2007, at the launch of the original iPhone. It includes a 412 MHz single-core ARM11 CPU and a PowerVR MBX Lite GPU. It was manufactured by Samsung on a 90 nm process. The iPhone 3G and the first-generation iPod touch also use it.

The APL0278 (also S5L8720) is a PoP SoC introduced on September 9, 2008, at the launch of the second-generation iPod touch. It includes a 533 MHz single-core ARM11 CPU and a PowerVR MBX Lite GPU. It was manufactured by Samsung on a 65 nm process.

The APL0298 (also S5L8920) is a PoP SoC introduced on June 8, 2009, at the launch of the iPhone 3GS. It includes a 600 MHz single-core Cortex-A8 CPU and a PowerVR SGX535 GPU. It was manufactured by Samsung on a 65 nm process.

The APL2298 (also S5L8922) is a 45 nm die shrunk version of the iPhone 3GS SoC and was introduced on September 9, 2009, at the launch of the third-generation iPod touch.

The Apple "A" series is a family of SoCs used in certain models of the iPhone, iPad other than the fifth generation iPad Pro, iPod Touch, and the Apple TV digital media player. They integrate one or more ARM-based processing cores ( CPU), a graphics processing unit ( GPU), cache memory and other electronics necessary to provide mobile computing functions within a single physical package.

The Apple A4 is a PoP SoC manufactured by Samsung, the first SoC Apple designed in-house. It combines an ARM Cortex-A8 CPU - also used in Samsung's S5PC110A01 SoC - and a PowerVR SGX 535 graphics processor (GPU), all built on Samsung's 45-nanometer silicon chip fabrication process. The design emphasizes power efficiency. The A4 commercially debuted in 2010, in Apple's iPad tablet, and was later used in the iPhone 4 smartphone, the fourth-generation iPod Touch, and the 2nd-generation Apple TV.

The Cortex-A8 core used in the A4, dubbed " Hummingbird", is thought to use performance improvements developed by Samsung in collaboration with chip designer Intrinsity, which was subsequently acquired by Apple It can run at far higher clock rates than other Cortex-A8 designs yet remains fully compatible with the design provided by ARM. The A4 runs at different speeds in different products: 1 GHz in the first iPads, 800 MHz in the iPhone 4 and fourth-generation iPod touch, and an undisclosed speed in the 2nd-generation Apple TV.

The A4's SGX535 GPU could theoretically push 35 million polygons per second and 500 million pixels per second, although real-world performance may be considerably less. Other performance improvements include additional L2 cache.

The A4 processor package does not contain RAM, but supports PoP installation. The 1st-generation iPad, fourth-generation iPod touch, and the 2nd-generation Apple TV have an A4 mounted with two low-power 128 MB DDR SDRAM chips (totaling 256 MB), while the iPhone 4 has two 256 MB packages for a total of 512 MB. The RAM is connected to the processor using ARM's 64-bit-wide AMBA 3 AXI bus. To give the iPad high graphics bandwidth, the width of the RAM data bus is double that used in previous ARM11- and ARM9-based Apple devices.

The Apple A5 is an SoC manufactured by Samsung that replaced the A4. The chip commercially debuted with the release of Apple's iPad 2 tablet in March 2011, followed by its release in the iPhone 4S smartphone later that year. Compared to the A4, the A5 CPU "can do twice the work" and the GPU has "up to nine times the graphics performance", according to Apple.

The A5 contains a dual-core ARM Cortex-A9 CPU with ARM's advanced SIMD extension, marketed as NEON, and a dual core PowerVR SGX543MP2 GPU. This GPU can push between 70 and 80 million polygons/second and has a pixel fill rate of 2 billion pixels/second. The iPad 2's technical specifications page says the A5 is clocked at 1 GHz, though it can adjust its frequency to save battery life. The clock speed of the unit used in the iPhone 4S is 800 MHz. Like the A4, the A5 process size is 45 nm.

An updated 32 nm version of the A5 processor was used in the 3rd-generation Apple TV, the fifth-generation iPod Touch, the iPad Mini, and the new version of iPad 2 (version iPad2,4). The chip in the Apple TV has one core locked. Markings on the square package indicate that it is named APL2498, and in software, the chip is called S5L8942. The 32 nm variant of the A5 provides around 15% better battery life during web browsing, 30% better when playing 3D games and about 20% better battery life during video playback.

In March 2013, Apple released an updated version of the 3rd-generation Apple TV (Rev A, model A1469) containing a smaller, single-core version of the A5 processor. Unlike the other A5 variants, this version of the A5 is not a PoP, having no stacked RAM. The chip is very small, just 6.1×6.2 mm, but as the decrease in size is not due to a decrease in feature size (it is still on a 32 nm fabrication process), this indicates that this A5 revision is of a new design. Markings tell that it is named APL7498, and in software, the chip is called S5L8947.

The Apple A5X is an SoC announced on March 7, 2012, at the launch of the third-generation iPad. It is a high-performance variant of the Apple A5; Apple claims it has twice the graphics performance of the A5. It was superseded in the fourth-generation iPad by the Apple A6X processor.

The A5X has a quad-core graphics unit (PowerVR SGX543MP4) instead of the previous dual-core as well as a quad-channel memory controller that provides a memory bandwidth of 12.8 GB/s, roughly three times more than in the A5. The added graphics cores and extra memory channels add up to a very large die size of 165 mm², for example twice the size of Nvidia Tegra 3. This is mainly due to the large PowerVR SGX543MP4 GPU. The clock frequency of the dual ARM Cortex-A9 cores have been shown to operate at the same 1 GHz frequency as in A5. The RAM in A5X is separate from the main CPU package.

The Apple A6 is a PoP SoC introduced on September 12, 2012, at the launch of the iPhone 5, then a year later was inherited by its minor successor the iPhone 5C. Apple states that it is up to twice as fast and has up to twice the graphics power compared to its predecessor the Apple A5. It is 22% smaller and draws less power than the 45 nm A5.

The A6 is said to use a 1.3 GHz custom Apple-designed ARMv7 based dual-core CPU, called Swift, rather than a licensed CPU from ARM like in previous designs, and an integrated 266 MHz triple-core PowerVR SGX 543MP3 graphics processing unit (GPU). The Swift core in the A6 uses a new tweaked instruction set, ARMv7s, featuring some elements of the ARM Cortex-A15 such as support for the Advanced SIMD v2, and VFPv4. The A6 is manufactured by Samsung on a high-κ metal gate (HKMG) 32 nm process.

Apple A6X is an SoC introduced at the launch of the fourth-generation iPad on October 23, 2012. It is a high-performance variant of the Apple A6. Apple claims the A6X has twice the CPU performance and up to twice the graphics performance of its predecessor, the Apple A5X.

Like the A6, this SoC continues to use the dual-core Swift CPU, but it has a new quad core GPU, quad channel memory and slightly higher 1.4 GHz CPU clock rate. It uses an integrated quad-core PowerVR SGX 554MP4 graphics processing unit (GPU) running at 300 MHz and a quad-channel memory subsystem. Compared to the A6 the A6X is 30% larger, but it continues to be manufactured by Samsung on a high-κ metal gate (HKMG) 32 nm process.

The Apple A7 is a 64-bit PoP SoC whose first appearance was in the iPhone 5S, which was introduced on September 10, 2013. The chip would also be used in the iPad Air, iPad Mini 2 and iPad Mini 3. Apple states that it is up to twice as fast and has up to twice the graphics power compared to its predecessor the Apple A6. The Apple A7 chip is the first 64-bit chip to be used in a smartphone.

The A7 features an Apple-designed 1.3-1.4 GHz 64-bit ARMv8-A dual-core CPU, called Cyclone, and an integrated PowerVR G6430 GPU in a four cluster configuration. The ARMv8-A architecture doubles the number of registers of the A7 compared to the A6. It now has 31 general-purpose registers that are each 64-bits wide and 32 floating-point/ NEON registers that are each 128-bits wide. The A7 is manufactured by Samsung on a high-κ metal gate (HKMG) 28 nm process and the chip includes over 1 billion transistors on a die 102 mm ² in size.

The Apple A8 is a 64-bit PoP SoC manufactured by TSMC. Its first appearance was in the iPhone 6 and iPhone 6 Plus, which were introduced on September 9, 2014. A year later it would drive the iPad Mini 4. Apple states that it has 25% more CPU performance and 50% more graphics performance while drawing only 50% of the power compared to its predecessor, the Apple A7. On February 9, 2018, Apple released the HomePod, which is powered by an Apple A8 with 1 GB of RAM.

The A8 features an Apple-designed 1.4 GHz 64-bit ARMv8-A dual-core CPU, and an integrated custom PowerVR GX6450 GPU in a four cluster configuration. The GPU features custom shader cores and compiler. The A8 is manufactured on a 20 nm process by TSMC, which replaced Samsung as the manufacturer of Apple's mobile device processors. It contains 2 billion transistors. Despite that being double the number of transistors compared to the A7, its physical size has been reduced by 13% to 89 mm ² (consistent with a shrink only, not known to be a new microarchitecture).

The Apple A8X is a 64-bit SoC introduced at the launch of the iPad Air 2 on October 16, 2014. It is a high performance variant of the Apple A8. Apple states that it has 40% more CPU performance and 2.5 times the graphics performance of its predecessor, the Apple A7.

Unlike the A8, this SoC uses a triple-core CPU, a new octa-core GPU, dual channel memory and slightly higher 1.5 GHz CPU clock rate. It uses an integrated custom octa-core PowerVR GXA6850 graphics processing unit (GPU) running at 450 MHz and a dual-channel memory subsystem. It is manufactured by TSMC on their 20 nm fabrication process, and consists of 3 billion transistors.

The Apple A9 is a 64-bit ARM-based SoC that first appeared in the iPhone 6S and 6S Plus, which were introduced on September 9, 2015. Apple states that it has 70% more CPU performance and 90% more graphics performance compared to its predecessor, the Apple A8. It is dual sourced, a first for an Apple SoC; it is manufactured by Samsung on their 14 nm FinFET LPE process and by TSMC on their 16 nm FinFET process. It was subsequently included in the first-generation iPhone SE, and the iPad (5th generation). The Apple A9 was the last CPU that Apple manufactured through a contract with Samsung, as all A-series chips after are manufactured by TSMC.

The Apple A9X is a 64-bit SoC that was announced on September 9, 2015, and released on November 11, 2015, and first appeared in the iPad Pro. It offers 80% more CPU performance and two times the GPU performance of its predecessor, the Apple A8X. It is manufactured by TSMC using a 16 nm FinFET process.

The Apple A10 Fusion is a 64-bit ARM-based SoC that first appeared in the iPhone 7 and 7 Plus, which were introduced on September 7, 2016. The A10 is also featured in the sixth-generation iPad, seventh-generation iPad and seventh-generation iPod Touch. It has a new ARM big.LITTLE quad core design with two high performance cores, and two smaller highly efficient cores. It is 40% faster than the A9, with 50% faster graphics. It is manufactured by TSMC on their 16 nm FinFET process.

The Apple A10X Fusion is a 64-bit ARM-based SoC that first appeared in the 10.5" iPad Pro and the second generation of the 12.9" iPad Pro, which were both announced on June 5, 2017. It is a variant of the A10 and Apple claims that it has 30 percent faster CPU performance and 40 percent faster GPU performance than its predecessor, the A9X. On September 12, 2017, Apple announced that the Apple TV 4K would be powered by an A10X chip. It is made by TSMC on their 10 nm FinFET process.

The Apple A11 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 8, iPhone 8 Plus, and iPhone X, which were introduced on September 12, 2017. It has two high-performance cores, which are 25% faster than the A10 Fusion, four high-efficiency cores, which are 70% faster than the energy-efficient cores in the A10, and for the first time an Apple-designed three-core GPU with 30% faster graphics performance than the A10. It is also the first A-series chip to feature Apple's "Neural Engine," which enhances artificial intelligence and machine learning processes.

The Apple A12 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone XS, XS Max and XR, which were introduced on September 12, 2018. It is also used in the third-generation iPad Air, fifth-generation iPad Mini, and the eighth-generation iPad. It has two high-performance cores, which are 15% faster than the A11 Bionic, and four high-efficiency cores, which have 50% lower power usage than the energy-efficient cores in the A11 Bionic. The A12 is manufactured by TSMC using a 7 nm FinFET process, the first to ship in a smartphone. It is also used in the 6th generation Apple TV.

The Apple A12X Bionic is a 64-bit ARM-based SoC that first appeared in the 11.0" iPad Pro and the third generation of the 12.9" iPad Pro, which were both announced on October 30, 2018. It offers 35% faster single-core and 90% faster multi-core CPU performance than its predecessor, the A10X. It has four high-performance cores and four high-efficiency cores. The A12X is manufactured by TSMC using a 7 nm FinFET process.

The Apple A12Z Bionic is a 64-bit ARM-based SoC based on the A12X that first appeared in the fourth generation iPad Pro, which was announced on March 18, 2020. The A12Z is also used in the Developer Transition Kit prototype computer that helps developers prepare their software for Macs based on Apple silicon.

The Apple A13 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 11, 11 Pro, and 11 Pro Max, which were introduced on September 10, 2019. It is also featured in the second-generation iPhone SE (released April 15, 2020) and in the 9th generation iPad (announced September 14, 2021).

The entire A13 Bionic SoC features a total of 18 cores - a six-core CPU, four-core GPU, and an eight-core Neural Engine processor, which is dedicated to handling on-board machine learning processes; four of the six cores on the CPU are low-powered cores that are dedicated to handling less CPU-intensive operations, such as voice calls, browsing the Web, and sending messages, while two higher-performance cores are used only for more CPU-intensive processes, such as recording 4K video or playing a video game.

The Apple A14 Bionic is a 64-bit ARM-based SoC that first appeared in the fourth-generation iPad Air and iPhone 12, released on October 23, 2020. It is the first commercially available 5 nm chipset and it contains 11.8 billion transistors and a 16-core AI processor. It includes Samsung LPDDR4X DRAM, a 6-core CPU, and 4-Core GPU with real time machine learning capabilities.

The Apple A15 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 13, unveiled on September 14, 2021. The A15 is built on a 5-nanometer manufacturing process with 15 billion transistors. It has 2 high-performance processing cores, 4 high-efficiency cores, a new 5-core graphics for iPhone 13 Pro series (4-core for iPhone 13&13 mini) processing unit, and a new 16-core Neural Engine capable of 15.8 trillion operations per second.

The Apple "S" series is a family of Systems in a Package (SiP) used in the Apple Watch. It uses a customized application processor that together with memory, storage and support processors for wireless connectivity, sensors, and I/O comprise a complete computer in a single package. They are designed by Apple and manufactured by contract manufacturers such as Samsung.

The Apple S1 is an integrated computer. It includes memory, storage and support circuits like wireless modems and I/O controllers in a sealed integrated package. It was announced on September 9, 2014, as part of the "Wish we could say more" event. It was used in the first-generation Apple Watch.

Used in Apple Watch Series 1. It has a dual-core processor identical to the S2, with the exception of the built-in GPS receiver. It contains the same dual-core CPU with the same new GPU capabilities as the S2, making it about 50% faster than the S1.

Used in the Apple Watch Series 2. It has a dual-core processor and a built-in GPS receiver. The S2's two cores deliver 50% higher performance and the GPU delivers twice as much as the predecessor, and is similar in performance to the Apple S1P.

Used in the Apple Watch Series 3. It has a dual-core processor that is 70% faster than the Apple S2 and a built-in GPS receiver. There is also an option for a cellular modem and an internal eSIM module. It also includes the W2 chip. The S3 also contains a barometric altimeter, the W2 wireless connectivity processor, and in some models UMTS (3G) and LTE (4G) cellular modems served by a built-in eSIM.

Used in the Apple Watch Series 4. It has a custom 64-bit dual-core processor based on the A12 with up to 2× faster performance. It also contains the W3 wireless chip, which supports Bluetooth 5. The S4 introduced 64-bit ARMv8 cores to the Apple Watch. The chip contains two Tempest cores, which are the energy-efficient cores found in the A12. Despite the small size, Tempest still uses a 3-wide decode out-of-order superscalar design, which make them much more powerful than previous in-order cores.

The S4 contains a Neural Engine that is able to run Core ML. Third-party apps can use it starting from watchOS 6. The SiP also includes new accelerometer and gyroscope functionality that has twice the dynamic range in measurable values of its predecessor, as well as being able to sample data at 8 times the speed. It also contains a new custom GPU, which can use the Metal API.

Used in the Apple Watch Series 5, Watch SE, and HomePod mini. It adds a built-in magnetometer to the custom 64-bit dual-core processor and GPU of the S4.

Used in the Apple Watch Series 6. It has a custom 64-bit dual-core processor that runs up to 20 percent faster than the S5. The dual cores in the S6 are based on the A13's energy-efficient " little" Thunder cores at 1.8 GHz. Like the S4 and S5, it also contains the W3 wireless chip. The S6 adds the new U1 ultra wideband chip, an always-on altimeter, and 5 GHz WiFi.

Used in the Apple Watch Series 7. The S7 has the same T8301 identifier and quoted performance as the S6.

The T series chip operates as a secure enclave on Intel-based MacBook and iMac computers released from 2016 onwards. The chip processes and encrypts biometric information ( Touch ID) and acts as a gatekeeper to the microphone and FaceTime HD camera, protecting them from hacking. The chip runs bridgeOS, a purported variant of watchOS.

The Apple T1 chip is an ARMv7 SoC (derived from the processor in the Apple Watch's S2) that drives the System Management Controller (SMC) and Touch ID sensor of the 2016 and 2017 MacBook Pro with Touch Bar.

The Apple T2 Security Chip is a SoC first released in the iMac Pro 2017. It is a 64-bit ARMv8 chip (a variant of the A10, or T8010), and runs bridgeOS 2.0. It provides a secure enclave for encrypted keys, enables users to lock down the computer's boot process, handles system functions like the camera and audio control, and handles on-the-fly encryption and decryption for the solid-state drive. T2 also delivers "enhanced imaging processing" for the iMac Pro's FaceTime HD camera.

The Apple "W" series is a family of SoCs and wireless chips with a focus on Bluetooth and Wi-Fi connectivity. "W" in model numbers stands for wireless.

The Apple W1 is a SoC used in the 2016 AirPods and select Beats headphones. It maintains a Bluetooth Class 1 connection with a computer device and decodes the audio stream that is sent to it.

The Apple W2, used in the Apple Watch Series 3, is integrated into the Apple S3 SiP. Apple said the chip makes Wi-Fi 85% faster and allows Bluetooth and Wi-Fi to use half the power of the W1 implementation.

The Apple "H" series is a family of SoCs used in headphones. "H" in model numbers stands for headphones.

The Apple H1 chip was first used in the 2019 version of AirPods, and was later used in the Powerbeats Pro, the Beats Solo Pro, the AirPods Pro, the 2020 Powerbeats, AirPods Max, and the AirPods (3rd generation). Specifically designed for headphones, it has Bluetooth 5.0, supports hands-free "Hey Siri" commands, and offers 30 percent lower latency than the W1 chip used in earlier AirPods.

The Apple "U" series is a family of Systems in a Package (SiP) implementing ultra-wideband radio.

The Apple U1 is used in the iPhone 11 and later (excluding the second generation iPhone SE), the Apple Watch Series 6 and Series 7, the HomePod mini and AirTag trackers.

The Apple "M" series is a family of Systems on a Chip (SoC) used in Mac computers from November 2020 or later and iPad Pro tablets from April 2021 or later. The "M" designation was previously used for Apple motion coprocessors.

The M1 chip, Apple's first processor designed for use in Macs, is manufactured using TSMC's 5 nm process. Announced on November 10, 2020, it is used in the MacBook Air (M1, 2020), Mac mini (M1, 2020), MacBook Pro (13-inch, M1, 2020), iMac (24-inch, M1, 2021), iPad Pro, 11-inch (3rd generation), and iPad Pro, 12.9-inch (5th generation).

The M1 Pro chip is a more powerful companion to the M1, with six to eight performance cores, two efficiency cores, 14 to 16 GPU cores, 16 Neural Engine cores, up to 32 GB unified RAM with up to 200 GB/s memory bandwidth, and more than double the transistors. It was announced on October 18, 2021, and is used in the 14- and 16-inch MacBook Pro. Apple said the CPU performance is about 70% faster than the M1, and that its GPU performance is about double. Apple claims the M1 Pro can deliver up to 20 streams of 4K or 7 streams of 8K ProRes video playback (up from 6 offered by Afterburner card for 2019 Mac Pro).

The M1 Max chip is a larger version of the M1 Pro chip, with eight performance cores, two efficiency cores, 24 to 32 GPU cores, 16 Neural Engine cores, up to 64 GB unified RAM with up to 400 GB/s memory bandwidth, and more than double the number of transistors. It was announced on October 18, 2021, and is used in the 14- and 16-inch MacBook Pro. Apple says it has 57 billion transistors. Apple claims the M1 Max can deliver up to 30 streams of 4K (up from 23 offered by Afterburner card for 2019 Mac Pro) or 7 streams of 8K ProRes video playback.

This segment is about Apple-designed processors that are not easily sorted into another section.

The 339S0196 is an ARM-based microcontroller used in Apple's Lightning Digital AV Adapter, a Lightning-to- HDMI adapter. This is a miniature computer with 256 MB RAM, running an XNU kernel loaded from the connected iOS device, then taking a serial signal from the iOS device translating that into a proper HDMI signal.

Name

Model
no.

Image

Die
size

Transistor count

CPU ISA

CPU

CPU
cache

AI accelerator

Memory
technology

First Released

Utilizing
devices

Initial OS

Terminal OS

APL
0098

90 nm
[10]

ARMv6

412 MHz single-core ARM11

L1i: 16 KB
L1d: 16 KB

N/A

LPDDR-266 Single-
channel 16-bit @[146]
133 MHz (533 MB/s)

June 29, 2007

iPhone OS 1.0

iPhone OS 3.1.3
iOS 4.2.1

APL
0278

65 nm
[7][10]

412-533 MHz single-core ARM11

September 9, 2008

iPhone OS 2.1.1

APL
0298

ARMv7

600 MHz single-core Cortex-A8

L1i: 32 KB
L1d: 32 KB
L2: 256 KB

June 19, 2009

iPhone OS 3.0

iOS 6.1.6

APL
2298

45 nm
[7][18][39]

600-800 MHz single-core Cortex-A8

September 9, 2009

iPhone OS 3.1.1

iOS 5.1.1

A4

APL
0398

0.8-1.0 GHz single-core Cortex-A8

L1i: 32 KB
L1d: 32 KB
L2: 512 KB

April 3, 2010

iPhone OS 3.2

iOS 5.1.1
iOS 6.1.6
iOS 7.1.2

A5

APL
0498

0.8-1.0 GHz dual-core Cortex-A9

PowerVR SGX543MP2 ( dual-core) @ 200 MHz (4 EUs, 32 ALUs) (12.8 GFLOPS)[149]

March 11, 2011

iOS 4.3

iOS 9.3.5
iOS 9.3.6

APL
2498

32 nm
Hκ MG
[40][46]

0.8-1.0 GHz dual-core Cortex-A9 ( one core locked in Apple TV)

March 7, 2012

iOS 5.1

APL
7498

1.0 GHz Single-core Cortex-A9 (single-core redesign from A5 dual-core)

January 28, 2013

Apple TV (3rd generation)
(Rev A, model A1469)

iOS 6.1

iOS 8.4.6

A5X

APL
5498

45 nm
[48]

1.0 GHz dual-core Cortex-A9

PowerVR SGX543MP4 ( quad-core) @ 200 MHz (8 EUs, 64 ALUs) (25.6 GFLOPS)[149]

March 16, 2012

iOS 5.1

iOS 9.3.5
iOS 9.3.6

A6

APL
0598

32 nm
Hκ MG
[58][151][61]

1.3 GHz[153] dual-core Swift[55]

PowerVR SGX543MP3 ( 3-core) @ 266 MHz (6 EUs, 48 ALUs) (68.0 GFLOPS)[57]

September 21, 2012

iOS 6.0

iOS 10.3.3
iOS 10.3.4

A6X

APL
5598

November 2, 2012

A7

APL
0698

28 nm
Hκ MG
[71][157]

≈1 billion

ARMv8.0-A [67][75]

1.3 GHz[64] dual-core Cyclone[67]

L1i: 64 KB
L1d: 64 KB
L2: 1 MB
L3: 4 MB (Inclusive)[67][158][65]

LPDDR3-1600 Single-channel 64-bit[76][159]@ 800 MHz (12.8 GB/s)

September 20, 2013

iOS 7.0

iOS 12.5.5

APL
5698

1.4 GHz[65] dual-core Cyclone[67]

November 1, 2013

iOS 7.0.3

A8

APL
1011

20 nm
( TSMC)
[76][75]

89
mm ²
[160][83]
[161]

~2 billion

Customized PowerVR GXA6450 ( quad-core) @ 533 MHz (16 EUs, 128 ALUs)[77][163][164] (136.4 GFLOPS)

September 19, 2014

iOS 8.0

tvOS 9.0 audioOS 11.0

iOS 12.5.5

Current

A8X

APL
1012

~3 billion

1.5 GHz 3-core[83][162] Typhoon

L1i: 64 KB
L1d: 64 KB
L2: 2 MB
L3: 4 MB[83] (Inclusive)[158]

Customized PowerVR GXA6850 ( 8-core) @ 450 MHz (32 EUs, 256 ALUs)[77][83][161] (230.4 GFLOPS)

LPDDR3-1600 Dual-channel 64-bit (128-bit)
@ 800 MHz (25.6 GB/s)[159][83]

October 22, 2014

iOS 8.1

Current

A9

APL
0898

14 nm
FinFET
( Samsung)
[165]

>2 billion

1.85 GHz dual-core[167][168] Twister

L1i: 64 KB
L1d: 64 KB
L2: 3 MB
L3: 4 MB ( Victim)

[158][169]

LPDDR4-3200 Single-channel 64-bit[168][169]@ 1600 MHz (25.6 GB/s)

September 25, 2015

iOS 9.0

APL
1022

16 nm
FinFET
( TSMC)
[166][171][172]

A9X

APL
1021

>3 billion

L1i: 64 KB
L1d: 64 KB
L2: 3 MB
L3: none[158][171]

November 11, 2015

iOS 9.1

A10 Fusion

APL
1W24

3.3 billion

ARMv8.1-A

L1i: 64 KB
L1d: 64 KB
L2: 3 MB
L3: 4 MB

Customized PowerVR GT7600 Plus ( 6-core) @ 900 MHz (24 EUs, 192 ALUs)[176][77](345.6 GFLOPS)[177][178]

September 16, 2016

iOS 10.0

A10X Fusion

10 nm FinFET ( TSMC)
[90]

>4 billion

L1i: 64 KB
L1d: 64 KB
L2: 8 MB
L3: none[180][181]
SLC: 4 MB

LPDDR4-3200 Dual-channel 64-bit (128-bit) @ 1600 MHz (51.2 GB/s)
[179][180]

June 13, 2017

iOS 10.3.2

tvOS 11.0

A11 Bionic

APL
1W72

4.3 billion

ARMv8.2-A [183]

2.39 GHz (2× Monsoon) + 1.19 GHz (4× Mistral) ( 6-core overall)

Apple-designed ( triple-core) @ 1066 MHz (24 EUs, 192 ALUs) (409.3 GFLOPS)

Neural Engine ( dual-core) 600 GOPS (billion operations/s)

LPDDR4X-4266 Single-channel 64-bit @ 2133 MHz (34.1 GB/s)
[184][185][186][187][188]

September 22, 2017

iOS 11.0

A12 Bionic

APL
1W81

6.9 billion

ARMv8.3-A [190]

L1i: 128 KB
L1d: 128 KB
L2: 8 MB
L3: none
SLC: 8 MB

Apple-designed ( quad-core) @ 1125 MHz (32 EUs, 256 ALUs) (576.0 GFLOPS)

Neural Engine ( octa-core) 5 TOPS

September 21, 2018

iOS 12.0
tvOS 14.5

A12X Bionic

APL
1083

10 billion

up to 2.49 GHz (4× Vortex) + up to 1.59 GHz (4× Tempest) ( 8-core overall)

Apple-designed ( 7-core) @ 1340 MHz (56 EUs, 448 ALUs) (1.20 TFLOPS)

November 7, 2018

iOS 12.1

A12Z Bionic

Apple-designed ( 8-core) @ 1340 MHz (64 EUs, 512 ALUs) (1.37 TFLOPS)

March 25, 2020

iPadOS 13.4

June 22, 2020

macOS Big Sur 11.0 Beta 1

macOS Big Sur 11.3 Beta 2

A13 Bionic

APL
1W85

8.5 billion

ARMv8.4-A [193]

up to 2.65 GHz (2x Lightning) + up to 1.8 GHz (4x Thunder) ( 6-core overall)

L1i: 128 KB
L1d: 128 KB
L2: 8 MB
L3: none
SLC: 16 MB

Neural Engine ( octa-core) 5.5 TOPS

LPDDR4X-4266 Single-channel 64-bit[195][196] @ 2133 MHz (34.1 GB/s)

September 20, 2019

iOS 13.0

Current

A14 Bionic

APL
1W01

11.8 billion

ARMv8.5-A

L1i: 192 KB
L1d: 128 KB
L2: 8 MB
(shared for performance cores) L2: 4 MB (shared for efficient cores)
L3: none
SLC: 16 MB

Apple-designed ( quad-core) @ 1000 MHz (64 EUs, 512 ALUs)[198][194][200] (1.0 TFLOPS)[201]

Neural Engine (16-core) 11 TOPS

October 23, 2020

iOS 14.0

A15 Bionic

APL
1W07[196]

107.68 mm ²[196]

15 billion

L1i: 192 KB
L1d: 128 KB
L2: 12 MB
(shared for performance cores) L2: 4 MB (shared for efficient cores)
L3: none
SLC: 32 MB

Apple-designed ( quad-core) @ 600 MHz (128 EUs, 1024 ALUs) (1.2 TFLOPS)[203][204][205]

Neural Engine (16-core) 15.8 TOPS

September 24, 2021

iOS 15.0

Name

Model
no.

Image

Die size

Transistor count

CPU ISA

CPU

CPU
cache

AI accelerator

Memory
bandwidth

First Released

Utilizing
devices

Initial OS

Terminal OS

Name

Model
no.

Image

Semiconductor
technology

Die size

CPU ISA

CPU

CPU cache

GPU

Memory
technology

First
Released

Utilizing
devices

T1

ARMv7

TBD

November
12, 2016

T2

TSMC 16 nm FinFET.[221]

104 mm ²[221]

ARMv8-A
ARMv7-A

2× Hurricane
2× Zephyr
+ Cortex-A7

3× cores[221]

LP-DDR4[221]

December
14, 2017

Name

Model
no.

Image

Semiconductor
technology

Die size

CPU ISA

CPU

CPU cache

GPU

Memory
bandwidth

First
Released

Utilizing
devices

Name

Model no.

Image

Bluetooth

First
Released

Utilizing
devices

H1

343S00289[225]
(AirPods 2nd Generation)
343S00290[226]
(AirPods 2nd Generation)
343S00404[227]
(AirPods Max)
H1 SiP[228]
(AirPods Pro)

5.0

March
20, 2019

Name

Model no.

Image

Bluetooth

First
Released

Utilizing
devices

Model no.

Image

First
Released

CPU ISA

Specs

Application

Utilizing
devices

Operating
system

339S0196

September 2012

Unknown

ARM

256 MB
RAM

Lightning to
HDMI conversion

Apple Digital
AV Adapter

XNU

Model
no.

Image

First
Released

CPU ISA

Specs

Application

Utilizing
devices

Operating
system

# data[].attributes.attachment_link.description
Apple silicon is a series of system on a chip (SoC) and system in a package (SiP) processors designed by Apple Inc., mainly using the ARM architecture. It is the basis of most new Mac computers as well as iPhone, iPad, Apple TV, and Apple Watch, and of products such as AirPods, HomePod, iPod Touch, and AirTag.

# data[].attributes.body
Processador revolucionário para desktops, que trás o conceito de memória e processamento (cálculos matemáticos e neurais) integrados, denominados SOCs